전자파 차폐용 RESIN (EMI Shield Film용 RESIN )
 
  • Application
  •  

    - Cellular phone, Digital video camera
       (Prevent electromagnetic noise interference due to an increased speed
       of transmitted signals)
     
  • Features

  • - Excellent wide band shielding performance and flexibility.
    - Good moisture absorption reflow-soldering.
    - High property to a high step.
    - Superior adaptability and suppleness.
    - Good cavity filling
    - Good abrasion resistance.
    - Excellent heat and chemical resistance.
     
     
  • KPI (Polyimide) RESIN Characters-Solution (Liquid Type)


  • (1) Tg (Glass Transition Temperature) : 280~400℃
    (2) TGA (weight loss 5% temperature) : Minimum 300℃
    (3) Excellent Flexibility
    (4) Strong Adhesive Ability
    (5) Stable Properties in hard circumstances
    (6) Halogen-Free
    (7) Wide Application with a cost (lower price than contemporary )
     
    (1) Heat Resistance Film
    (2) Cover Ray Film
    (3). Thin Film P(A)I Layer
    (4) Flexible Cupper Clay Layer Film
    (5) LED Glass Dielectric Coating
    (6) Belt for Copy & Fax Machines
    (7) Metal Coating for Dielectric and Heat Resistance
    (8) Heat Resistance Adhesive
    (9) Binder for Lithium Battery
     
  • Properties of KPI 850-**
  •  
    Properties Unit KPI 850 - ** Remarks

    Thickness

    Real thickness

    4.5  

    Mechanical

    Tensile Strength

    MD

    Mpa

    62

    ASTM D 882

    TD 65

    Elongation at Break

    MD

    %

    65
    TD 62

    Modulus

    MD

    Gpa

    2.3
    TD 2.8

    Thermal

    Coefficient of Thermal Expansion

    MD

    ppm/ ℃

    38.2 TMA Method (100~200℃)
    TD 39.5

    Glass Transition Temperature

    305 DSC Method

    Electrical

    Dielectric Sterngth

    kv

    1.4 ASTM D 149